High Reliability Capability
FA/AE Capability
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FA/AE Capability
 

SEM & EDX
SEM (Scanning Electron Microscopy)
Used to inspect the surface of devices at high magnification.
DEX (Energy Dispersive X-Ray)
Used as a microanalysis system coupled with SEM for element analysis and contamination.
X-Ray Thickness Measurement
Workstage : 400 *450mm 
Coating thickness measure and composition analysis.

 

 

X-Ray Television Inspection System
Working stage : 350 * 300mm / 2 Kg 
X-Ray output: 130 KV / 130uA
Focus size : Min. 1um 
Hardness Tester
Inspection Mode : HV / HK
X-Y stage max. movement : 25 * 25mm

 

 

Projector
Workstage : 203.5*101.6*54mm
Projection Lense : *10 / *50
Measurement : Length and Angular
Resolution : 1um / 0.1 deg
Pull and Shear Force Tester
Working stage : 50*50mm
Force gauge : 0~5 Kg / 1~100 Kg
Working spedd : 12.5 ~ 331 mm/min

 

 

Electro Press
Pressing force : 1~1000 Kg (0.1 Kg)
Working distance : 0 ~100mm
Min. pressing space : 0.001mm
Press speed : 0.1~35mm/S
Connect with computer real time record pressing force.
Viscometer
Accuracy : +/- 1% full scale range


 

FEA Modeling
Stress Analysis-Dynamic


 

FEA Modeling
Stress Analysis Result

 

 

 

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